As part of the 50th anniversary lecture series of the Department of Physics (DFis) at the University of Aveiro, an open lecture dedicated to deposition technologies applied to the semiconductor industry was held, delivered by PhotonExport, an associated member of Inova-Ria.
The session, led by Ernesto Barrera, brought together more than 30 participants and provided an in-depth technical analysis of the processes, challenges and trends associated with thin film deposition — a critical technology for the development of advanced electronic devices.
Thin films are material layers with thicknesses ranging from nanometers to several micrometers, playing a decisive role in the electrical, structural and functional performance of microchips.
Key applications include:
Gate oxides (SiO₂ / HfO₂) with thicknesses between 1 and 5 nm
Diffusion barriers (TiN / TaN) between 5 and 50 nm
Interlayer dielectrics (100–200 nm)
Metallization processes
Nanometer-scale precision in these deposition processes is essential to ensure miniaturization, energy efficiency and long-term reliability of semiconductor devices.
During the session, PhotonExport also presented its activity in the field of materials and substrates, including sapphire, silicon wafers, sputtering targets and evaporation materials — fundamental components in semiconductor device manufacturing.
The lecture clarified the different stages of microchip fabrication:
Front-End of Line (FEOL) – responsible for the formation of advanced transistors such as MOSFET, FinFET and GAAFET, involving oxidation, dielectric deposition, doping, lithography and etching processes.
Back-End of Line (BEOL) – dedicated to interconnecting millions or billions of transistors through metallic layers, barriers and dielectric materials.
This approach placed deposition technologies within the real industrial manufacturing context, highlighting their strategic role across the semiconductor value chain.
Three core technologies used in frontend manufacturing were addressed:
ALD – Atomic Layer Deposition
A cyclic, self-limiting process that ensures high conformality and atomic-level thickness control, particularly effective in structures with high aspect ratios (AR).
PVD – Physical Vapor Deposition
Including magnetron sputtering and e-beam evaporation, enabling controlled deposition of metals, oxides and nitrides, widely used in both R&D and industrial environments.
CVD – Chemical Vapor Deposition (LPCVD, PECVD, MOCVD)
Notable for its batch processing capability, allowing the simultaneous treatment of 25 to 50 wafers with high uniformity and film quality.
The technical challenge of filling high aspect ratio structures was also discussed, comparing the performance of different technologies and emphasizing the importance of conformality in complex three-dimensional geometries.
The semiconductor industry is characterized by high technical requirements and significant capital investment, operating in cleanroom environments with strict particle and flow control. The complete processing cycle of a single wafer may take several weeks before final delivery.
PhotonExport also highlighted the possibility of recycling and recovering sputtering targets, reinforcing the importance of sustainability within the technological value chain.
Beyond the industrial component, the company promotes specialized training in semiconductor processes, plasma etching, vacuum systems and cleanroom management, supporting universities and R&D centers in the development of advanced technical skills.
The session concluded with a strategic reflection on Portugal’s positioning within the European semiconductor and microelectronics ecosystem. While the country does not host large-scale fabs comparable to major international manufacturing hubs, Portugal holds relevant competencies in chip design, technological development, software engineering, academic research and the use of cleanroom infrastructures for prototyping and testing.
In a structurally cyclical sector driven by areas such as artificial intelligence, digital health and predictive systems, strengthening investment in R&D, fostering closer academia-industry collaboration and consolidating specialized technical expertise are key factors in reinforcing Portugal’s role within this highly demanding and globalized value chain.
The organization of this open lecture as part of the DFis 50th anniversary celebrations further reinforces the importance of knowledge and technology transfer, as well as the connection between scientific research, industry and technological development, a mission that Inova-Ria continues to promote through its network of associated companies and innovation ecosystem.
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